ColdBridge^TM

Our Customized Solutions

Our customized solutions to design integrated circuits, and computer system and software, computer software consultancy, and semiconductor research and development.

3D Package Design and Consultancy Service--- ColdBridge^TM solution

ColdBridge^TM is a new 3D package solution to thermal performance of integrated circuits and semiconductor products. As power module delivers higher output current, the challenges associated with heat dissipation also intensify. At Richtek, we understand the critical importance of managing heat effectively to ensure optimal performance and longevity of your electronic components.

Our innovative ColdBridge^TM technology offers high thermal conductivity by integrating inductors into a single frame. This advanced design allows for efficient heat transfer from MOSFETs to the top surface, and subsequently to the cold plate heat sink. By leveraging our expertise, we can assist you in designing product structures that maximize heat dissipation, effectively reducing MOSFET temperatures and enhancing overall system reliability.

Choose ColdBridge^TM technology for cutting-edge solutions that keep your devices cool and performing at their best. Let us help you overcome the challenges of heat dissipation with our state-of-the-art technology and expert support.

For more information, please contact our sales representative and order this service .